Magazine Rack · 50 Slots · Gear-Adjustable · 200 °C Bake-Suitable

B0103GM-200C · 50-Slot Gear-Adjustable ESD Magazine Rack

B0103GM-200C200 °CIn stock · USA

50-slot ESD magazine rack rated to 200 °C (392 °F), bake-suitable per IPC/JEDEC J-STD-033 moisture-removal profiles. Boards stay in the same rack from MSD storage through 125 °C bake through SMT line entry. Same gear-track adjustment (50–250 mm), same chassis as B0103GN-80C, same NASTC + SGS compliance. One rack handles the whole MSD workflow, stocked in the USA.

$247.80 per unit
  • Adjustable Width: 50–250 mm
  • Slot Count / Pitch: 50 @ 10 mm
  • Max Board (L × W): 355 × 250 mm
  • Temp Range: −20 / +200 °C
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ESD-safe Ships from the USA Spec help included
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Stop Transferring MSD Boards Between a Bake Tray and the Loader.

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Standard 80 °C racks can’t enter a bake oven, so MSD boards have to move into a separate baking container and back, extra handling, extra ESD exposure, extra chance of damage. The B0103GM-200C is rated to **200 °C**: boards stay in the same rack from MSD storage through 125 °C bake through the SMT loader. One container, one workflow.

200 °C bake-suitable

J-STD-033 compliant

50–250 mm adjustable

SMT loader compatible

At a glance

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Adjustable Width50–250 mm
Slot Count / Pitch50 @ 10 mm
Max Board (L × W)355 × 250 mm
Temp Range−20 / +200 °C

Description

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What it does on your line

The B0103GM-200C is a 50-slot ESD magazine rack rated to 200 °C (392 °F), built for in-line SMT automation plus moisture-sensitive device (MSD) baking. Same chassis and gear-track mechanism as the B0103GN-80C, the difference is the higher-temperature material qualification, which makes the rack bake-suitable per IPC/JEDEC J-STD-033 moisture-removal profiles (typically 90–125 °C for 24–72 hours).

Construction: 5 interchangeable Conductive PPE side panels per wall, aluminum pillars, galvanized steel base. The mixed-material build maintains structural rigidity through repeated thermal cycling, and keeps the entire current path in the conductive 10⁴–10⁶ Ω band per ESD Association classification. Boards stay in this rack from MSD storage through bake through the SMT line, no transfer container, no extra ESD exposure points.

Gear-track adjustment sets board width from 50 to 250 mm with parallelism maintained across all 50 slots. For higher-temperature aerospace or extreme cure cycles (300 °C), use the B0103GL HT-300C all-aluminum sibling on the same chassis.

B0103GN-80C detail view 1
FIG. 2B0103GM-200C

See it in motion

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360° rotation · B0103GM-200C

Technical specifications

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ModelB0103GM-200C
MaterialsConductive PPE side panels (5 × interchangeable per wall) · aluminum pillars · galvanized steel base
Dimensions (L × W × H)355 × 320 × 563 mm (13.98″ × 12.60″ × 22.17″)
Slot count50
Slot width5 mm (0.197″)
Slot depth3.5 mm (0.138″)
Slot pitch10 mm (0.394″)
Adjustable board width50–250 mm (1.97″–9.84″) via gear-track mechanism
Max board length355 mm (13.98″)
Max board size (L × W)355 × 250 mm
Min board size (L × W)50 × 50 mm
Reference positionsA = 34 mm · B = 34 mm
ESD propertiesSurface resistance 10⁴ – 10⁶ Ω (conductive band per ESD Association)
ESD test resultsNASTC Report 2025AS4693AP (Nov 2025): point-to-point 3.24 × 10⁴ Ω · ground 4.86 × 10⁴ Ω · surface −7 V (spec < 100 V) · decay 0.2 s (spec ≤ 2 s), ALL PASS
Temperature range−20 °C to +200 °C (−4 °F to 392 °F), bake-suitable per IPC/JEDEC J-STD-033
Adjustment typeGear track with parallelism monitoring
IncludesStopper bar · carrying handles (top and bottom)
Weight6.3 kg
PartB0103GM-200CRev2026-AUnitsmm / °C
Documentation

Need drawings or CAD models? Request them by email

Built for ESD-protected workstations

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Materials: 5 × Conductive PPE side panels · aluminum pillars · galvanized steel base

Surface res.: 10⁴ – 10⁶ Ω, conductive band per ESD Association

NASTC test: Report 2025AS4693AP (Nov 2025), point-to-point, ground, voltage, decay all **PASS**

Thermal range: −20 °C to +200 °C, bake-suitable per IPC/JEDEC J-STD-033

Capacity: 50 slots · 10 mm pitch · 50–250 mm adjustable · max board 355 × 250 mm

RoHS: **PASS**, EU Directive (EU) 2015/863. Verified by SGS Report No. NGBEC25007648601 (1 Dec 2025). All 20 components tested, Pb, Hg, Cd, Cr⁶⁺, PBB, PBDE, DEHP, BBP, DBP, DIBP all PASS.

ESD: NASTC Report 2025AS4693AP, tested per SJ/T 10694-2022 and WJ 2146-2016 by MII Anti-Static Products Quality Supervision and Testing Center.

Best for: MSD moisture-removal bake · in-line SMT automation · post-cure storage · thermal cycling.

Not for: Cure / cycle > 200 °C (use the [B0103GL HT-300C](pcb-b0103gl-ht-300c-shop-standalone.html) all-aluminum variant for 300 °C aerospace cure).

What's in the box

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  • Sold individually. Packaging size 570 × 370 × 100 mm at 6.3 kg gross. Stocked at the US warehouse for same-week ship on standard orders. Includes stopper bar and carrying handles (top + bottom).

Volume pricing

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QuantityPrice per unitYou save
1–19$247.80,
20+$223.0210%
Volume discounts apply automatically in cart50+ units? Distributor pricing →

Related parts & spares

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Engineers also bought

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Questions engineers ask

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What does “bake-suitable per J-STD-033” actually mean?
IPC/JEDEC J-STD-033 specifies the bake conditions required to remove absorbed moisture from MSDs (Moisture-Sensitive Devices) before reflow. Typical profiles run at **90–125 °C for 24–72 hours**, with a 125 °C accelerated cycle option for shorter durations. The GM-200C’s 200 °C ceiling provides headroom over the 125 °C accelerated profile, so boards can stay in this rack from MSD storage through the full bake cycle without transfer to a separate baking container.
What’s the difference between the GM-200C and the GN-80C?
**Same chassis, same gear track, same materials, same compliance, same weight**, the only difference is temperature qualification. The [B0103GN-80C](pcb-b0103gn-80c-shop-standalone-rev2.html) is rated −20 °C to +80 °C (standard SMT envelope, lower cost). The B0103GM-200C is rated −20 °C to +200 °C (bake-suitable per J-STD-033, slightly higher cost). Pick GN if your boards never see a bake cycle; pick GM if any of your line involves moisture-removal bake.
Will the B0103GM-200C drop into my SMT loader / unloader?
Yes. The 563 mm chassis height and 10 mm slot pitch match the standard interface for ASM SIPLACE, Yamaha YSM, Panasonic NPM, Juki RS, and most other in-line SMT loader / unloader equipment. The 355 × 320 mm footprint is identical to the B0103GN-80C, B0103GC BELT-80C, and B0103GL HT-300C variants. If your line uses a non-standard fixture, ask sales for a fit-check before ordering.
What does “parallelism monitored” gear-track adjustment actually do?
Both side panels travel on a synchronized rack-and-pinion gear track. Turn the adjustment knob on either side and the opposite panel travels the same distance in the same direction, parallelism is **mechanically monitored**, not just operator-eyeballed. The result: a width spec set on Monday loads the same boards on Friday, and both panels stay parallel through the full 50–250 mm travel range.
Can I run conformal coat post-cure or aerospace-grade thermal cycles in this rack?
The GM-200C handles conformal-coat post-cure cycles up to 200 °C without panel softening or off-gassing. For **aerospace cure or extreme thermal stress testing above 200 °C** (typically 250–300 °C), use the [B0103GL HT-300C all-aluminum](pcb-b0103gl-ht-300c-shop-standalone.html) variant on the same chassis, it swaps the Conductive PPE side panels for aluminum to handle the higher temperature.
What ships in the box?
One B0103GM-200C magazine rack, sold individually. Includes **stopper bar** and **carrying handles** (top and bottom). Packaging size 570 × 370 × 100 mm at 6.3 kg gross. Stocked at the US warehouse, most orders ship the same week. No assembly required.