Magazine Rack · 50 Slots · Gear-Adjustable · All-Aluminum · 300 °C

B0103GL HT-300C · 50-Slot All-Aluminum 300 °C ESD Magazine Rack

B0103GL HT-300C300 °CIn stock · USA

50-slot ESD magazine rack built for extreme thermal cycles, 5 × interchangeable aluminum side panels (no PPE / no PS), 7.5 mm wide slot for thicker / warped / populated boards out of reflow, and a 300 °C ceiling for aerospace cure, lead-free reflow direct loading, and high-heat stress testing. Same 355 × 320 × 563 mm chassis as B0103GN. NASTC ESD-tested, SGS RoHS PASS. Stocked in the USA.

$275.52 per unit
  • Adjustable Width: 50–250 mm
  • Slot Count / Pitch: 50 @ 10 mm
  • Max Board (L × W): 355 × 250 mm
  • Temp Range: −20 / +300 °C
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Lead-Free Reflow Pushes Past What Plastic Panels Can Handle.

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Lead-free soldering pushed reflow temperatures 30–40 °C higher than leaded processes. Boards exiting reflow / wave / selective solder are too hot for plastic-panel racks. The B0103GL HT’s aluminum panels handle sustained 300 °C, load boards **directly from the oven**, no cooling step, no rack swap. The 7.5 mm wide slot also clears thicker, warped, or populated boards that bind in the standard 5 mm slot.

300 °C ceiling

All-aluminum panels

7.5 mm wide slot

Lead-free direct loading

At a glance

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Adjustable Width50–250 mm
Slot Count / Pitch50 @ 10 mm
Max Board (L × W)355 × 250 mm
Temp Range−20 / +300 °C

Description

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What “all-aluminum” actually changes

The B0103GL HT-300C swaps the standard PPE side panels for 5 × interchangeable aluminum sections per wall, no polymer in the thermal path, so the rack stays dimensionally stable through cycles to 300 °C. Lead-free reflow exit temperatures, IPC/JEDEC J-STD-033 accelerated bake, conformal-coat post-cure, and aerospace high-heat stress testing all run inside the rack’s thermal envelope, load directly from the oven, no cooling step required.

The slot opens to 7.5 mm wide (vs 5 mm on regular gear-track) to clear thicker / warped / populated boards that have grown out of spec after reflow. Same 50-slot capacity, same 10 mm pitch, same gear-track mechanism, same 50–250 mm adjustable width range as the B0103GN-80C cousin. The aluminum-panel construction adds 1.7 kg of weight (8 kg vs 6.3 kg empty) for the higher-temperature qualification.

Same NASTC ESD report and SGS RoHS certificate as the rest of the B0103 chassis family. The B0103GN-80C and B0103GM-200C cousins offer the same chassis at a lower price for cycles that don’t exceed 80 / 200 °C.

B0109GL HT-300C detail view 1
FIG. 2B0103GL HT-300C

See it in motion

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360° rotation · B0103GL HT-300C

Technical specifications

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ModelB0103GL HT-300C
MaterialsAluminum side panels (5 × interchangeable per wall, no polymer) · aluminum pillars · galvanized steel base
Dimensions (L × W × H)355 × 320 × 563 mm (13.98″ × 12.60″ × 22.17″)
Slot count50
Slot width7.5 mm (0.295″), wider than gear-track 5 mm; clears thicker / warped / populated boards
Slot depth3.5 mm (0.138″)
Slot pitch10 mm (0.394″)
Adjustable board width50–250 mm (1.97″–9.84″) via gear-track mechanism
Max board length355 mm (13.98″)
Max board size (L × W)355 × 250 mm
Min board size (L × W)50 × 50 mm
Reference positionsA = 34 mm · B = 33 mm
ESD propertiesSurface resistance 10⁴ – 10⁶ Ω (conductive band per ESD Association)
ESD test resultsNASTC Report 2025AS4693AP (Nov 2025): point-to-point 3.24 × 10⁴ Ω · ground 4.86 × 10⁴ Ω · surface −7 V (spec < 100 V) · decay 0.2 s (spec ≤ 2 s), ALL PASS
Temperature range−20 °C to +300 °C (−4 °F to 572 °F), top of the magazine-rack thermal range
Adjustment typeGear track with parallelism monitoring
IncludesStopper bar · carrying handles (top and bottom)
Weight8 kg
PartB0103GL HT-300CRev2026-AUnitsmm / °C
Documentation

Need drawings or CAD models? Request them by email

Built for ESD-protected workstations

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Materials: 5 × Aluminum side panels · aluminum pillars · galvanized steel base (no polymer in the thermal path)

Surface res.: 10⁴ – 10⁶ Ω, conductive band per ESD Association

NASTC test: Report 2025AS4693AP (Nov 2025), point-to-point, ground, voltage, decay all **PASS**

Thermal range: −20 °C to +300 °C, top of the magazine-rack thermal range

Capacity: 50 slots · 10 mm pitch · 50–250 mm adjustable · 7.5 mm wide slot · max board 355 × 250 mm

RoHS: **PASS**, EU Directive (EU) 2015/863. Verified by SGS Report No. NGBEC25007648601 (1 Dec 2025). All 20 components tested, Pb, Hg, Cd, Cr⁶⁺, PBB, PBDE, DEHP, BBP, DBP, DIBP all PASS.

ESD: NASTC Report 2025AS4693AP, tested per SJ/T 10694-2022 and WJ 2146-2016 by MII Anti-Static Products Quality Supervision and Testing Center.

Best for: Lead-free reflow direct loading · aerospace cure · conformal-coat post-cure · J-STD-033 accelerated bake · high-heat stress testing.

Not for: Standard 80 °C envelopes where 300 °C capability is unused (cheaper variants on the same chassis: [GN-80C](pcb-b0103gn-80c-shop-standalone-rev2.html) / [GM-200C](pcb-b0103gm-200c-shop-standalone-rev2.html)).

What's in the box

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  • Sold individually. Packaging size 570 × 370 × 100 mm at 8 kg gross. Stocked at the US warehouse for same-week ship on standard orders. Includes stopper bar and carrying handles (top + bottom).

Volume pricing

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QuantityPrice per unitYou save
1–19$275.52,
20+$247.9710%
Volume discounts apply automatically in cart50+ units? Distributor pricing →

Related parts & spares

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Engineers also bought

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Questions engineers ask

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What does “all-aluminum” actually change vs the standard 200 °C gear-track racks?
Standard gear-track racks (the GN/GM variants) use 5 × **Conductive PPE** side-panel sections per wall. PPE softens above ~200 °C and starts off-gassing in cure ovens. The HT series swaps every PPE panel for an **aluminum panel**, same five interchangeable slots per wall, same gear-track mechanism, no polymer in the thermal path. The chassis is heavier (8 kg vs 6.3 kg empty) and the rack stays dimensionally stable through 300 °C cycles.
Why is the slot 7.5 mm wide instead of 5 mm?
Boards that have just come out of reflow or post-cure are often slightly **thicker, warped, or populated with tall components** on the bottom side. The 5 mm gear-track slot is fine for raw bare boards, but a 1.6 mm board with 2 mm of solder paste + 1 mm of warp + a populated underside can exceed 5 mm. The 7.5 mm HT slot accommodates these without forcing operators to angle boards in or rework the slot. You can still load thinner boards in the wider slot, they just sit with more clearance.
Can I really load boards directly from a lead-free reflow oven?
Yes. The 300 °C ceiling clears typical SAC305 lead-free reflow profiles (peak ~245–260 °C) with significant headroom. The all-aluminum side panels won’t soften, warp, or contaminate the reflow atmosphere. Aerospace cure cycles, conformal-coat post-cure (150–200 °C), and full IPC/JEDEC J-STD-033 bake (including 125 °C accelerated) are all well within the rack’s thermal envelope.
Will the B0103GL HT-300C drop into my SMT loader / unloader?
Yes. The 563 mm chassis height and 10 mm slot pitch match the standard interface for ASM SIPLACE, Yamaha YSM, Panasonic NPM, Juki RS, and most other in-line SMT loader / unloader equipment. The 355 × 320 mm footprint is identical to the B0103GN-80C / GM-200C / GC BELT-80C variants. Note the unique reference offsets **A=34, B=33** on this HT variant (vs A=34, B=34 on GN/GM/GC), ask sales for a fit-check on your specific line if your fixture relies on B-offset positioning.
Do I need 300 °C if my bake only runs at 125 °C?
Probably not. For 125 °C accelerated bake or anything below 200 °C, the metal-base [B0103GM-200C (200 °C)](pcb-b0103gm-200c-shop-standalone-rev2.html) is a lower-cost option on the same chassis, same NASTC ESD report, same SGS RoHS. Pick the GL HT-300C when the process actually needs 200–300 °C (lead-free reflow direct loading, conformal-coat post-cure 150–200 °C, aerospace cure, or thermal stress testing).
What ships in the box?
One B0103GL HT-300C magazine rack, sold individually. Includes **stopper bar** and **carrying handles** (top and bottom). Packaging size 570 × 370 × 100 mm at 8 kg gross. Stocked at the US warehouse, most orders ship the same week. No assembly required.