50-slot ESD magazine rack on the maximum-format chassis, rated to 200 °C (392 °F), bake-suitable per IPC/JEDEC J-STD-033 moisture-removal profiles. Backplanes, motherboards, and oversized PCBs (up to 535 × 460 mm) stay in the same rack from MSD storage through 125 °C bake through SMT line entry. Same gear-track adjustment (50–460 mm) and same chassis as B0109GN-80C, with the higher-temperature material qualification. NASTC ESD-tested, SGS RoHS PASS. Stocked in the USA.
Standard 80 °C racks can’t enter a bake oven, so MSD backplanes / motherboards have to move into a separate baking container and back, extra handling, extra ESD exposure, extra chance of damage on heavy oversized boards. The B0109GM-200C is rated to **200 °C** on the same maximum-format chassis: backplanes (up to 535 × 460 mm) stay in the same rack from MSD storage through 125 °C bake through the SMT loader. One container, one workflow.
The B0109GM-200C is a maximum-format 50-slot ESD magazine rack rated to 200 °C (392 °F), built for in-line SMT automation plus moisture-sensitive device (MSD) baking on the widest board lines, backplanes, motherboards, oversized industrial PCBs. Same chassis and gear-track mechanism as the B0109GN-80C, the difference is the higher-temperature material qualification, which makes the rack bake-suitable per IPC/JEDEC J-STD-033 moisture-removal profiles (typically 90–125 °C for 24–72 hours).
Construction: 5 interchangeable Conductive PPE side panels per wall, aluminum pillars, galvanized steel base. Same conductive 10⁴–10⁶ Ω surface band per ESD Association classification, same NASTC test report. The bake-suitable PPE qualification adds headroom for J-STD-033 accelerated bake (125 °C) and conformal-coat post-cure (typically 150–200 °C) without panel softening or off-gassing.
Gear-track adjustment sets board width from 50 to 460 mm with parallelism maintained across all 50 slots, widest gear range in the catalog. For aerospace-grade cure cycles above 200 °C, use the B0109GL HT-300C all-aluminum sibling on the same maximum chassis (300 °C ceiling, swaps PPE for aluminum panels).
360° rotation · B0109GM-200C
| Model | B0109GM-200C |
|---|---|
| Materials | Conductive PPE side panels (5 × interchangeable per wall) · aluminum pillars · galvanized steel base |
| Dimensions (L × W × H) | 535 × 530 × 569 mm (21.06″ × 20.87″ × 22.40″) |
| Slot count | 50 |
| Slot width | 5 mm (0.197″) |
| Slot depth | 3.5 mm (0.138″) |
| Slot pitch | 10 mm (0.394″) |
| Adjustable board width | 50–460 mm (1.97″–18.11″) via gear-track mechanism |
| Max board length | 535 mm (21.06″) |
| Max board size (L × W) | 535 × 460 mm, widest gear-track board capacity in catalog |
| Min board size (L × W) | 50 × 50 mm |
| Reference positions | A = 34 mm · B = 40 mm, shared with the B0108 chassis |
| ESD properties | Surface resistance 10⁴ – 10⁶ Ω (conductive band per ESD Association) |
| ESD test results | NASTC Report 2025AS4693AP (Nov 2025): point-to-point 3.24 × 10⁴ Ω · ground 4.86 × 10⁴ Ω · surface −7 V (spec < 100 V) · decay 0.2 s (spec ≤ 2 s), ALL PASS |
| Temperature range | −20 °C to +200 °C (−4 °F to 392 °F), bake-suitable per IPC/JEDEC J-STD-033 |
| Adjustment type | Gear track with parallelism monitoring (screw adjustment configuration also available) |
| Includes | Stopper bar · carrying handles (top and bottom) |
| Weight | 13.2 kg |
Materials: 5 × Conductive PPE side panels · aluminum pillars · galvanized steel base
Surface res.: 10⁴ – 10⁶ Ω, conductive band per ESD Association
NASTC test: Report 2025AS4693AP (Nov 2025), point-to-point, ground, voltage, decay all **PASS**
Thermal range: −20 °C to +200 °C, bake-suitable per IPC/JEDEC J-STD-033
Capacity: 50 slots · 10 mm pitch · 50–460 mm adjustable · max board 535 × 460 mm
RoHS: **PASS**, EU Directive (EU) 2015/863. Verified by SGS Report No. NGBEC25007648601 (1 Dec 2025). All 20 components tested, Pb, Hg, Cd, Cr⁶⁺, PBB, PBDE, DEHP, BBP, DBP, DIBP all PASS.
ESD: NASTC Report 2025AS4693AP, tested per SJ/T 10694-2022 and WJ 2146-2016 by MII Anti-Static Products Quality Supervision and Testing Center.
Best for: MSD moisture-removal bake (J-STD-033) · in-line SMT automation · post-cure storage · thermal cycling · maximum-format (up to 535 × 460 mm) board lines · backplanes / motherboards / oversized industrial PCBs.
Why buy: Aerospace-grade build, stocked in the USA, full B0109 maximum-format chassis family (GN / GM / GC BELT / GL HT) sharing one footprint, mix variants on one purchase order with the same logistics, same compliance package, same volume tier. One workflow from MSD storage through bake through the loader.
| Quantity | Price per unit | You save |
|---|---|---|
| 1–19 | $494.00 | , |
| 20+ | $444.60 | 10% |
50-slot ESD magazine rack on the maximum-format chassis, sized for the widest boards in the catalog: backplanes, motherboards, and oversized industrial PCBs up to 535 × 460 mm.
80 °C Gear track$406.8050-slot ESD magazine rack on the maximum-format chassis, with continuous belt adjustment covering 10–460 mm of board width, the widest belt range in the catalog.
80 °C Continuous belt$531.4050-slot ESD magazine rack, the widest 300 °C rack in the catalog.
300 °C 300 °C all-aluminum$509.7550-slot ESD magazine rack rated to 200 °C (392 °F), bake-suitable per IPC/JEDEC J-STD-033 moisture-removal profiles.
200 °C Gear · 200 °C$247.8050-slot ESD magazine rack built for in-line SMT loaders and unloaders.
80 °C Gear track$182.4050-slot ESD magazine rack with conductive PS base rated to 120 °C (248 °F), covers most MSD low-bake profiles (90–110 °C) without stepping up to a metal-base 200 °C rack.
120 °C Gear · 120 °C bake$189.7050-slot ESD magazine rack with conductive PS base in place of galvanized steel, the lightest rack in the magazine catalog.
80 °C Gear track$173.80
